Search Results for: adhesion in microelectronics

Adhesion In Microelectronics

Adhesion in Microelectronics PDF
Author: K. L. Mittal
Publisher: John Wiley & Sons
Size: 69.82 MB
Format: PDF, ePub, Docs
Category : Technology & Engineering
Languages : en
Pages : 368
View: 2944

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Adhesion In Microelectronics Book Description

by K. L. Mittal, Adhesion In Microelectronics Books available in PDF, EPUB, Mobi Format. Download Adhesion In Microelectronics books, This comprehensive book will provide both fundamental andapplied aspects of adhesion pertaining to microelectronics in asingle and easily accessible source. Among the topics to be coveredinclude; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials asit pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve adhesion Unraveling of interfacial interactions using an array ofpertinent techniques Characterization of interfaces / interphases Polymer-polymer adhesion Metal-polymer adhesion (metallized polymers) Polymer adhesion to various substrates Adhesion of thin films Adhesion of underfills Adhesion of molding compounds Adhesion of different dielectric materials Delamination and reliability issues in packaged devices Interface mechanics and crack propagation Adhesion measurement of thin films and coatings

Adhesion Measurement Of Films And Coatings

Adhesion Measurement of Films and Coatings PDF
Author: Kash L. Mittal
Publisher: CRC Press
Size: 47.56 MB
Format: PDF, ePub, Docs
Category : Science
Languages : en
Pages : 352
View: 5817

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Adhesion Measurement Of Films And Coatings Book Description

by Kash L. Mittal, Adhesion Measurement Of Films And Coatings Books available in PDF, EPUB, Mobi Format. Download Adhesion Measurement Of Films And Coatings books, This book documents the proceedings of the Second International Symposium on Adhesion Measurement of Films and Coatings, held in Newark, NJ, October 25-27, 1999. Since the First Symposium (Boston 1992) there had been considerable activity in devising new, more reliable and more efficient ways to measure adhesion of films and coatings, which resulte

Microelectronics Packaging Handbook

Microelectronics Packaging Handbook PDF
Author: Rao Tummala
Publisher: Springer Science & Business Media
Size: 52.21 MB
Format: PDF
Category : Computers
Languages : en
Pages : 1030
View: 872

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Microelectronics Packaging Handbook Book Description

by Rao Tummala, Microelectronics Packaging Handbook Books available in PDF, EPUB, Mobi Format. Download Microelectronics Packaging Handbook books, This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.

Dielectric Material Integration For Microelectronics

Dielectric Material Integration for Microelectronics PDF
Author: Electrochemical Society. Dielectric Science and Technology Division
Publisher: The Electrochemical Society
Size: 68.23 MB
Format: PDF
Category : Technology & Engineering
Languages : en
Pages : 366
View: 1634

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Dielectric Material Integration For Microelectronics Book Description

by Electrochemical Society. Dielectric Science and Technology Division, Dielectric Material Integration For Microelectronics Books available in PDF, EPUB, Mobi Format. Download Dielectric Material Integration For Microelectronics books,

Microelectronics Technology And Devices Sbmicro 2009

Microelectronics Technology and Devices SBMicro 2009 PDF
Author: Davies William de Lima Monteiro
Publisher: The Electrochemical Society
Size: 42.60 MB
Format: PDF, Docs
Category : Electrochemistry
Languages : en
Pages : 623
View: 6362

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Microelectronics Technology And Devices Sbmicro 2009 Book Description

by Davies William de Lima Monteiro, Microelectronics Technology And Devices Sbmicro 2009 Books available in PDF, EPUB, Mobi Format. Download Microelectronics Technology And Devices Sbmicro 2009 books, This issue of ECS Transactions features eight invited and sixty-seven regular papers on technology, devices, systems, optoelectronics, modeling and characterization; all either directly or indirectly related to microelectronics. The topics presented herein reveal the multidisciplinary character of this field, which definitely incites the highly cooperative trace of human nature.

Interfacial Compatibility In Microelectronics

Interfacial Compatibility in Microelectronics PDF
Author: Tomi Laurila
Publisher: Springer Science & Business Media
Size: 12.26 MB
Format: PDF, Kindle
Category : Technology & Engineering
Languages : en
Pages : 218
View: 5971

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Interfacial Compatibility In Microelectronics Book Description

by Tomi Laurila, Interfacial Compatibility In Microelectronics Books available in PDF, EPUB, Mobi Format. Download Interfacial Compatibility In Microelectronics books, Interfaces between dissimilar materials are met everywhere in microelectronics and microsystems. In order to ensure faultless operation of these highly sophisticated structures, it is mandatory to have fundamental understanding of materials and their interactions in the system. In this difficult task, the “traditional” method of trial and error is not feasible anymore; it takes too much time and repeated efforts. In Interfacial Compatibility in Microelectronics, an alternative approach is introduced. In this revised method four fundamental disciplines are combined: i) thermodynamics of materials ii) reaction kinetics iii) theory of microstructures and iv) stress and strain analysis. The advantages of the method are illustrated in Interfacial Compatibility in Microelectronics which includes: solutions to several common reliability issues in microsystem technology, methods to understand and predict failure mechanisms at interfaces between dissimilar materials and an approach to DFR based on deep understanding in materials science, rather than on the use of mechanistic tools, such as FMEA. Interfacial Compatibility in Microelectronics provides a clear and methodical resource for graduates and postgraduates alike.

Microelectronic Packaging

Microelectronic Packaging PDF
Author: M. Datta
Publisher: CRC Press
Size: 80.16 MB
Format: PDF, ePub
Category : Technology & Engineering
Languages : en
Pages : 568
View: 5378

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Microelectronic Packaging Book Description

by M. Datta, Microelectronic Packaging Books available in PDF, EPUB, Mobi Format. Download Microelectronic Packaging books, Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization. Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impact of electrochemical technology on packaging. The second part discusses chip metallization topics including the development of robust barrier layers and alternative metallization materials. Part III explores key aspects of chip-package interconnect technologies, followed by Part IV's analysis of packages, boards, and connectors which covers materials development, technology trends in ceramic packages and multi-chip modules, and electroplated contact materials. Illustrating the importance of processing tools in enabling technology development, the book concludes with chapters on chemical mechanical planarization, electroplating, and wet etching/cleaning tools. Experts from industry, universities, and national laboratories submitted reviews on each of these subjects, capturing the technological advances made in each area. A detailed examination of how packaging responds to the challenges of Moore's law, this book serves as a timely and valuable reference for microelectronic packaging and processing professionals and other industrial technologists.

Electrical Contact Resistance Of Anisotropic Conductive Adhesive Assemblies In Microelectronics Packaging

Electrical Contact Resistance of Anisotropic Conductive Adhesive Assemblies in Microelectronics Packaging PDF
Author: Melida Chin
Publisher:
Size: 69.62 MB
Format: PDF, ePub, Mobi
Category :
Languages : en
Pages :
View: 6369

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Electrical Contact Resistance Of Anisotropic Conductive Adhesive Assemblies In Microelectronics Packaging Book Description

by Melida Chin, Electrical Contact Resistance Of Anisotropic Conductive Adhesive Assemblies In Microelectronics Packaging Books available in PDF, EPUB, Mobi Format. Download Electrical Contact Resistance Of Anisotropic Conductive Adhesive Assemblies In Microelectronics Packaging books,